任何对关心实现高直通率和高可靠性的无铅焊点及想了解如何实现的相关人员都应该参加。 Any one who care about achieving high yield and high reliability lead-free solder joints and like to know how to achieve them should take this course.
您能从此课程中学到哪些内容： 这个课程覆盖了电子行业在无铅转换中发生的焊接相关的问题。更重要的是它也体现了近年来行业在尽力解决这些问题作出的努力和成果。强调了波峰焊，选择性波峰焊和维修的制造工艺。讲述表面处理引起的问题，特别是锡须。关于焊料的选择，会提及什么样的合金焊料是合适的，权衡利弊，如何选择及评估。详细讨论那些难以避免的问题例如混合合金及便携设备对冲击损坏的敏感性. 基于有价值的案例提供建议.最后，回顾近来在对可靠性以及机械性关键因素的研究，来回答如何实现高可靠性的问题。 What You Can Learn From This Course: This course covers the soldering related issues ailing the electronic manufacturing industry during lead-free conversion. Most importantly, it also presents the most recent efforts and results of the industry in trying to resolve those issues. The manufacturing practice emphasizes on wave soldering, selective soldering, and rework. The problems caused by surface finishes, particularly tin whiskers, are addressed. Regarding the solder materials, what solder alloys are available for selection, what is the pro and con, how to select, and how to evaluate, are presented. The inevitable issues such as mixed alloys and sensitivity of portable devices toward impact failure are discussed in details, with advices provided based on valuable cases study experience. Finally, the questions about how to deliver a high reliability are answered with a close review of most recent studies on critical factors affecting reliability and the mechanisms involved.
本课程将涵盖以下主题： 主题 Topics 1. 表面处理问题 1. Issues of Surface Finish (1) 裂缝腐蚀 (1) Creep corrosion (2) 各种表面处理的品质和性能 (2) Quality and performance of various surface finishes (3) 各种表面处理的可靠性比较 (3) Comparison of reliability of various surface finishes